| 摘要 |
PROBLEM TO BE SOLVED: To provide a low electric resistance and strong mechanical connection function to a semiconductor chip by forming a thermosetting insulating resin layer on a surface, where a semiconductor chip is mounted and forming an independent conductor terminal at a position, where the electrode of a semiconductor chip is connected to a conductor wiring of a wiring board. SOLUTION: A liquid thermosetting insulating resin vanish forming a thermosetting insulating resin layer 16 is so coated on the surface of a copper foil 15 such that the thickness of the thermo-setting insulating resin layer 16 at a part sandwiched between a conductor terminal 18 and a conductor wiring 12 is 0.7-1.5 times the thickness of the conductor terminal 18 plus that of a surface treatment 19. Then a two-layer sheet 17 is formed by drying it, which is heated/pressurized to be laminated on the surface of a wiring board 11, with the conductor wiring 12 formed, where a semiconductor chip is mounted. Then a photosensitized resist film is formed on both surfaces of a solder resist 14 and the copper foil 15, to form the conductor terminal 18 going through such processes as pattern exposure, resist development, copper etching, and resist peeling.
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