| 摘要 |
PROBLEM TO BE SOLVED: To prevent a COB(chip outline band) structure body from acting as an obstacle element, when the COB structure body is operated in an electromagnetic field. SOLUTION: This chip outline band (COB) structure body is used in a integrated circuit, which is integrated in a semiconductor chip having a first conductivity-type semiconductor substrate 1, and the substrate is biased to a common reference potential (GND) of the integrated circuit. The chip outline band structure body is provided with a substantially annular region 3 formed in the substrate 1 along its periphery, and at least annular conducting regions 40, 60 which is superposed on the annular region 3 and is in contact with the annular region 3. The region 3 is electrically connected with a point of the common reference potential (GND). |
