| 摘要 |
This radiation curable ink composition comprises, by weight of the total composition: 1. 30-95 % of a bis phenol-A epoxy resin of formula (I), where n = 0-20, 2. 0.1-25 % of an organofunctional silane of formula (II), wherein n = 0-3, a = 0-2, Y = formula (III); X is each independently CH3, Cl, OCOCH3, OC2H4OCH3, (OC2H4)2OCH3, or -OR, where R is a C1-20 straight or branched chain alkyl, preferably OCH3 or OCH2CH3; 3. 0.1-25 % of a cationic photoinitiator, and 4. 0.05-20 % of a fluorinated surfactant; Also included are methods for and decorated end products produced with the composition
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