| 摘要 |
<p>A process of epitaxially growing a Group (IV) semiconductor film on a surface (WS) of a substrate (W) made of a material comprising one of Si or Ge in a reaction chamber (14) under vacuum. The process includes the steps of heating the substrate to a temperature between 300 °C and 650 °C, then introducing into the reaction chamber a first reactant gas containing one of Si and Ge corresponding to the material comprising the substrate while bombarding the surface with energetic ions having a flux ratio of about between 0.5 and 5 eV/adatom. The first reactant gas may be silane and the substrate made of Si, in which case the semiconductor film grown is Si. Alternatively, the first reactant gas may be germane and the substrate made of Ge, in which case the semiconductor film grown is Ge. Likewise, compounds of Si, Ge and C may be formed by introducing reactant gases comprising Si, Ge and C, for example silane, germane and methane, in the appropriate ratios.</p> |
