| 摘要 |
<p>The board 200 has input, output and intermediate nodes; pads 212, 214 for coupling a first component between the input node and the output node; pads 222, 224 for coupling a second component between the input node and earth; pads 232, 234 for coupling a third component between the output node and the datum potential; pads 242, 244 for coupling a fourth component between the input node and the intermediate node; pads 252, 254 for coupling a fifth component between the intermediate node and the datum potential; and pads 262, 264 for coupling a sixth component between the intermediate node and the output node. The components may be added in stages until necessary impedance matching performance is obtained. In arrangements using fewer components, no unnecessary wiring nor blank components are required. This minimises energy losses while allowing more complex multi-element configurations to be used if necessary without PCB re-design.</p> |
