发明名称 |
Method of fabrication of semiconductor device and mounting structure thereof |
摘要 |
A semiconductor device capable of facilitating high density mounting at low cost without causing any defective conduction at the time of connection to a substrate, a mounting structure thereof and a method of fabrication thereof, characterized in that pyramidal bump electrodes are bonded onto pad electrodes arranged on a semiconductor chip to form the semiconductor device. <IMAGE> |
申请公布号 |
EP1022775(A1) |
申请公布日期 |
2000.07.26 |
申请号 |
EP19980932531 |
申请日期 |
1998.07.15 |
申请人 |
HITACHI, LTD. |
发明人 |
WATANABE, TAKAYOSHI;SHIGI, HIDETAKA;KASUKABE, SUSUMU;MORI, TERUTAKA |
分类号 |
H01L21/56;H01L21/60;H01L23/00;H01L23/485 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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