| 摘要 |
<p>This invention is concerning a method of manufacturing diodes with ceramic base (1) and dice (5) structure. It includes cutting grooves (11 Fig. 3) on the base (1) structure to form units, forming lower layer conductors (2) on each units of the base structure, printing resistors (3) and the dice (5) adhering to the base (1) structure, coating the base (1) structure with covering materials (4). Salient (54) on the dice (5) tip is then printed or plated with conductors. In this way, upper layer conductors (6) are formed in order to link it to the border of each unit. Based on the brittle property of the base (1), it is cleaved into elongated rectangular blocks (12, Fig. 24) and terminals (8) on the lateral are formed. After being cauterized, they are broken into a single die (5). The solder metals (81) are adhered to surface of the terminals (8), and then electrical detection and packing are conducted. The method may also be used to manufacture capacitors, inductors, or resistors.</p> |
