Method of joining a covered wire and a covered wire with a low-melting point layer therein,申请号GB20000013359-传众专利搜索

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发明名称	Method of joining a covered wire and a covered wire with a low-melting point layer therein
摘要
申请公布号	GB0013359(D0)	申请公布日期	2000.07.26
申请号	GB20000013359	申请日期	2000.06.01
申请人	YAZAKI CORPORATION	发明人
分类号	H01R4/70;H01R4/02;H01R43/02	主分类号	H01R4/70
代理机构		代理人
主权项
地址

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