发明名称 |
Microchip module mounting structure |
摘要 |
An apparatus such as a portable computer including a microchip module constituted by a substrate and semiconductor chips mounted thereon. The microchip module is surrounded and supported by an annular frame. The microchip module and the annular frame are fixed to a motherboard by screws. A heat-radiating plate is attached to the microchip module to constitute a microchip module unit. The arrangement including the annular frame protects the microchip module from vibration and impact, and improves a grounding function, a heat radiating efficiency, and a shielding function.
|
申请公布号 |
US6094348(A) |
申请公布日期 |
2000.07.25 |
申请号 |
US19970837906 |
申请日期 |
1997.04.11 |
申请人 |
FUJITSU LIMITED |
发明人 |
KANBAYASHI, KO;HAMAGUCHI, TOYOKAZU |
分类号 |
G06F15/02;G06F1/16;G06F1/20;H05K7/20;H05K9/00;(IPC1-7):H05H7/20 |
主分类号 |
G06F15/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|