发明名称 Microchip module mounting structure
摘要 An apparatus such as a portable computer including a microchip module constituted by a substrate and semiconductor chips mounted thereon. The microchip module is surrounded and supported by an annular frame. The microchip module and the annular frame are fixed to a motherboard by screws. A heat-radiating plate is attached to the microchip module to constitute a microchip module unit. The arrangement including the annular frame protects the microchip module from vibration and impact, and improves a grounding function, a heat radiating efficiency, and a shielding function.
申请公布号 US6094348(A) 申请公布日期 2000.07.25
申请号 US19970837906 申请日期 1997.04.11
申请人 FUJITSU LIMITED 发明人 KANBAYASHI, KO;HAMAGUCHI, TOYOKAZU
分类号 G06F15/02;G06F1/16;G06F1/20;H05K7/20;H05K9/00;(IPC1-7):H05H7/20 主分类号 G06F15/02
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