| 摘要 |
PURPOSE: A method for direct attachment bonding semiconductor chips is provided to attach a bare chip(not packaged) and a circuit substrate directly to improve electrical characteristics of the bonding. CONSTITUTION: A method for direct attachment bonding semiconductor chips includes following steps. At the first step, a solder bump(3,19) is formed on a pattern pad of circuit substrate which is connected to a semiconductor bare chip. At the second step, an amorphous conductive paste(16) is applied on the solder bump. At the third step, the bare chip(1) is mounted on the solder bump and is solidified. At the forth step, an electrical coupling between an external electrode of the bare chip and the circuit substrate is completed. The amorphous conductive paste according to the present invention is made by dispersing plurality of conductive particles whose diameters are in the range of 3-10 micrometer. |
