SEMICONDUCTOR SUBSTRATE POLISHING PAD DRESSER, METHOD OF MANUFACTURING THE SAME, AND CHEMICOMECHANICAL POLISHING METHOD USING THE SAME DRESSER

摘要

PURPOSE: A semiconductor substrate polishing pad dresser is provided to raise a yield rate and acquire a stable grinding speed by restraining a scratch defect at a minimum. CONSTITUTION: A semiconductor substrate polishing pad dresser adapted to be brought into sliding contact with a surface to be polished of a semiconductor substrate polishing pad and thereby subject the polishing pad to a conditioning operation, the dresser including a support member have a surface opposed to the polishing pad, a solder alloy material layer covering the surface of the support member, and hard abrasive grains supported in a distributed and buried state on the solder alloy material layer and exposed at a part of each thereof to the outside of the solder alloy material layer. The portions of the surfaces of the hard abrasive grains which contact the solder alloy are coated with a metal carbide layer or a metal nitride layer. The usable solder alloys include Ag alloy and Ag-Cu alloy.