| 摘要 |
PURPOSE: A bonding structure of a silicon wafer and a substrate is provided to simplify the connection of the silicon wafer and the substrate without using expensive apparatuses. CONSTITUTION: A bonding structure of a silicon wafer and a substrate includes a fixing member(38), an attachment member(39), and a signal transfer member(37). The fixing member(38) supports a conductive pole with a non-conductive tape sheet for the coupling of the silicon wafer and the substrate. The attachment member(39) is formed on both sides of the fixing member, and the attachment member is adhesive. The signal transfer member(37) according to the present invention is implemented between the wafer and the substrate on which a pattern of the lead frame is formed penetrating the fixing member and attachment member.
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