| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition whose heat resistance can easily be improved and whose peel strength after heat-treated for peeling purpose can easily be reduced by including a curable resin and a specific thermally expandable material. SOLUTION: This composition is obtained by including (A) a curable resin and (B) a thermally expandable inorganic material; wherein the thermally expandable material is such one as to mean that when the volume change thereof is measured by raising the temperature thereof, its volume is increased (expanded) at a specified temperature (normally, its thermal expansion beginning temperature) which is normally >=150 deg.C, pref. >=200 deg.C, esp. pref. 250-500 deg.C; the expansion ratio involved (measured along the maximum expansion direction, being a factor of dimension after expansion relative to that before expansion) is normally >=1.1, pref. >=1.2, esp. pref. 1.3-30.
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