| 摘要 |
PROBLEM TO BE SOLVED: To obtain a hot-melt adhesive improved in high-temperature adhesion while maintaining low-temperature adhesion by including an ethylene-based copolymer, a tackifying resin, and a specific paraffin wax. SOLUTION: This hot-melt adhesive is obtained by including (A) 100 pts.wt. of an ethylene-based copolymer, (B) 50-200 pts.wt. of a tackifying resin, and (C) 20-100 pts.wt. of a purified paraffin wax with a melting point of >=72 deg.C and oil content of <0.12 wt.%; wherein the component A is a copolymer of (i) ethylene and (ii) an ethylenically unsaturated monomer (e.g. vinyl acetate, a monocarboxylic vinyl ester, acrylic ester); the component B is e.g. an aliphatic hydrocarbon resin, alicyclic hydrocarbon resin, aromatic hydrocarbon resin, polyterpene resin; and the component C is such one as to be prepared by further purifying an ordinary paraffin wax solid at normal temperatures separated from distillate oil from the vacuum distillation of crude oil.
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