| 摘要 |
PROBLEM TO BE SOLVED: To obtain a laminating material excellent in heat resistance and room temperature peel strength by forming a layer of a thermosetting lowly dielectric resin composition containing a siloxane-modified polyimide, a (methyl) allyl-containing compound, a compound having a plurality of maleimido compounds, and a diamine compounds on either surface of a releasable film or a metallic foil. SOLUTION: This material is obtained by forming a layer of a siloxane- modified polyimide comprising structural units represented by formula I to III; a (methyl)allyl-containing compound represented by formula IV or V; a compound having at least two maleimido groups, desirably, a compound of e.g. formula VI; and a compound represented by the formula: H2N-R5-NH2 or a polysiloxane compound represented by formula VI on either surface of a releasable film or a metal foil. In formula I to III, X is a direct bond, O, SO2, CO or the like; Ar1 is a divalent organic group having 1 or 2 OH or COOH groups; R is -CH2OC6H4 bonded to Si through its methylene or a 1-10C alkylene; and (n) is 1-20. In formula IV and V, R is H or CH3; R5 and R6 are each a divalent aliphatic group, an aromatic group or the like; and (n) in formula VII is 1-8. |
