发明名称 |
Chemical-mechanical polishing pad conditioning systems |
摘要 |
A conditioning wafer for conditioning a polishing pad employed in chemical-mechanical polishing of an integrated circuit substrate is described. The conditioning wafer includes a disk having a conditioning surface and a plurality of abrasive particles secured on the conditioning surface of the disk. Furthermore, the abrasive particles engage with the polishing pad when the conditioning wafer contacts the polishing pad during conditioning of the polishing pad.
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申请公布号 |
US6093280(A) |
申请公布日期 |
2000.07.25 |
申请号 |
US19970912597 |
申请日期 |
1997.08.18 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
KIRCHNER, ERIC J.;KALPATHY-CRAMER, JAYASHREE |
分类号 |
B24B37/04;B24B53/12;B24D7/06;H01L21/306;(IPC1-7):C23F1/02 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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