METHOD FOR FABRICATING LEAD FRAME AND SEMICONDUCTOR DEVICE INCLUDING THEREOF

摘要

PURPOSE: A method for fabricating a lead frame and a semiconductor device including thereof is provided in order to provide a lead frame which can assure the electrical stability without being transformed by the inflow of a resin in a step of sealing up the semiconductor device with the resin. CONSTITUTION: A lead frame includes: a first row inner lead(51A) electrically connected to connection electrodes(54) of a semiconductor chip(2) respectively; a second row inner lead(51B) which is connected electrically to the connection electrode of the semiconductor chip and is located on the counter part of the first row inner lead; a first row outer lead(52A) electrically connected to a connection inner lead in the first row inner lead; a second row outer lead(52B) electrically connected to the connection inner lead in the second row inner lead; and a tie bar(53) connecting a first outermost inner lead(51a) of the first row inner lead to a second outermost inner lead(51b) in the second row inner lead. A control plate(101) which comprises a first branch(101A) prolonged from a first outermost inner lead(101a) to a second outermost inner lead(101b) and a second branch(101B) prolonged from the second outermost inner lead to the first outermost inner lead is connected to the tie bar.