| 摘要 |
PURPOSE: A dual chip package is provided to singularize a manufacturing line of the dual chip, thereby simplifying a fabricating and assembling process of a memory device and thus increasing a productivity. CONSTITUTION: A dual chip package comprises a first memory chip having a first optional pad and a second memory chip having a second optional pad. The first and second memory chips are respectively connected through the first and second optional pads to each power source which is different each other. The first and second memory chip comprise a memory cell array with memory cells, a page buffer for detecting a data of the memory cell, a global buffer for receiving and transferring an outer address and a command, a data input/output buffer for inputting and outputting the data, a command register for receiving the command and a pulse signal and generating a master signal to control a program, and a chip-selecting and mode controlling circuit which determines whether a chip is selected and by which the data input/output buffer is non-activated when the chip is not selected.
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