Thermal monitoring system for semiconductor devices

摘要

A method for monitoring the operating temperature of a semiconductor device. The method comprising the steps of: placing a thermal coupling material between the bottom of the semiconductor device and the top of a printed circuit board for inserting the device thereinto; inserting a sensor so to be at least partially covered by the thermal coupling material; and measuring the temperature from the sensor within a predetermined time interval. In accordance with another aspect of the invention, an apparatus is described to carry out the above process.