| 摘要 |
A high frequency shielding case of a semiconductor laser apparatus, according to the present invention, comprises a soldering fixing plate, together with a semiconductor laser holding member, fixed by a screw to a fixing member, a shielding case half overlaid on the fixing plate on a side opposite to the holding member and having an opening through which a terminal of the semiconductor laser is inserted, an additional shielding case half overlaid on the above-mentioned shielding case half and co-acting with the above-mentioned shielding case half to store a high frequency oscillation circuit board connected to the terminal, and a solder connecting a solder attaching portion of the fixing plate to a portion of at least one of the above-mentioned shielding case half and additional shielding case half, the portion corresponding to the solder attaching portion.
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