发明名称 Heat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation plates
摘要 A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.
申请公布号 US6094344(A) 申请公布日期 2000.07.25
申请号 US19990433209 申请日期 1999.11.04
申请人 HITACHI, LTD. 发明人 NAKAGAWA, TSUYOSHI;NEHO, YASUSHI;SAKAMOTO, NAOYUKI;OHASHI, SHIGEO;OHMURA, YOSHITO;IWAMA, YUKIKO;NAKAJIMA, TADAKATSU;KONDO, YOSHIHIRO;IWAI, SUSUMU;MATSUSHIMA, HITOSHI
分类号 G06F1/20;H05K1/02;H05K1/14;H05K1/18;H05K3/36;H05K7/20;(IPC1-7):G06F1/20 主分类号 G06F1/20
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