| 摘要 |
<p>PURPOSE: A structure and method for mounting an electronic circuit unit is provided with a good wrap, wettability of the cream solders to end face electrodes. CONSTITUTION: A printed board has broad width lands and thin width lands tied with the broad width lands configured by a solder resist that is formed on the surface of the printed board. Thereby, the solders placed on the thin width lands are drawn near the broad width lands, which increases the quantity of the solders on the board width lands, and accompanied with the increase, the build-up of the solders on the broad width lands is made higher, whereby the soldering with the electronic circuit unit can be made reliable.</p> |
