APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An apparatus and a method for testing a semiconductor package are provided to rapidly perform a test of shearing stress for a plurality of solder balls utilized as input and output terminals. CONSTITUTION: In an apparatus for testing a semiconductor package, a plurality of power sensing parts(10) is formed of a rod cell structure for sensing a certain power for converting to an electrical signal to output and movable in x-axis. A power transferring part(20) is positioned at one side of the power sensing part to transfer a predetermined power in the x-axis direction and includes a spring(21), and first and second bars(22,23) in front of and behind the spring, in a main body(24) in the shape of approximately hexahedron, and an x-axis rail(27) at a bottom surface of the main body so that the main body moves along the rail. A lever part(30) contacts the second bar of the power transferring part at one end part and pushes a solder ball(53) in the x-axis direction with the other end part by rotating with relation to a rotation shaft(32) so that the shearing force of the solder ball is transferred to the power sensing part via the power transferring part.