发明名称 SEMICONDUCTOR DEVICE HAVING SOI STRUCTURE AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A semiconductor device is provided to form on a SOI substrate having a high-concentration impurity diffusion region and to apply to an integrated circuit operated by a low voltage, and a manufacturing method thereof. CONSTITUTION: A semiconductor device with an SOI structure comprises; an SOI substrate having a buried insulating film and a first conductivity type surface semiconductor layer on the buried insulating film; second conductivity type source and drain regions formed in the surface semiconductor layer; and a gate electrode formed over a first conductivity type channel region between the source and drain regions via a gate insulating film, wherein the source and drain regions are thinner than the surface semiconductor layer, and the channel region in the surface semiconductor layer has a first conductivity type high-concentration impurity diffusion region whose first conductivity type impurity concentration is higher than that in a surface of the channel region and which is adjacent to the buried insulating film.
申请公布号 KR20000047907(A) 申请公布日期 2000.07.25
申请号 KR19990054814 申请日期 1999.12.03
申请人 SHARP CORPORATION 发明人 ADAN ALBERTO OSCAR
分类号 H01L29/78;H01L21/8238;H01L27/08;H01L27/092;H01L27/12;H01L29/786;(IPC1-7):H01L29/78 主分类号 H01L29/78
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