| 摘要 |
PURPOSE: A system provides a solder which does not react with the thermoelectric material to provide a source of diffusants, dopants, and reagents. CONSTITUTION: A thermoelectric module (10) is formed with solder joints (28, 30), the solder containing about 50 to 99 weight percent bismuth and about 50 to 1 weight percent antimony, between the thermoelectric elements (12, 14) and the connecting conductors (24, 26). Also provided is a thermoelectric module (10) having bismuth telluride elements (12, 14) coated with a conductive material (16, 18) that does not require a nickel or other diffusion barrier. Further provided are modules (10) having conductors (24, 26) with a phosphorus-nickel surface (20, 22). Methods of manufacturing and using such thermoelectric modules (10) are further provided.
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