发明名称 |
SUBSTRATE PROCESSING APPARATUS |
摘要 |
PURPOSE: An apparatus for processing a substrate is provided to simplify an inner structure of a reaction chamber and further to improve a pollution control capability of a wafer. CONSTITUTION: An improved apparatus for processing a substrate such as a wafer(101) includes a reaction chamber(103) and a transfer chamber(105). In addition, the apparatus includes a loading chamber(102) and an unloading chamber neighboring with the loading chamber(102). The transfer chamber(105) is connected to each chamber(102,103) by a gate valve(106). The reaction chamber(103) has a susceptor(203) supporting the wafer(101) and plural push-up pins(205) disposed under the susceptor(203). The push-up pins(205) move up and down through holes formed in the susceptor(203). The transfer chamber(105) has a transfer arm(107) horizontally carrying the wafer(101) and a pin-driving arm(108) driving the push-up pins(205) for loading or unloading of the wafer(101). Therefore, the wafer(101) is loaded onto or unloaded from the susceptor(203) by combinational operations of the transfer arm(107) and the pin-driving arm(108).
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申请公布号 |
KR20000048002(A) |
申请公布日期 |
2000.07.25 |
申请号 |
KR19990055810 |
申请日期 |
1999.12.08 |
申请人 |
KOKUSA ELECTRIC CO., LTD. |
发明人 |
MIYAUCHI AKIHIRO;INOUYE YOSUKE;SUJUKI TAKAYA |
分类号 |
H01L21/68;H01L21/205;H01L21/677;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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