发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PURPOSE: An apparatus for processing a substrate is provided to simplify an inner structure of a reaction chamber and further to improve a pollution control capability of a wafer. CONSTITUTION: An improved apparatus for processing a substrate such as a wafer(101) includes a reaction chamber(103) and a transfer chamber(105). In addition, the apparatus includes a loading chamber(102) and an unloading chamber neighboring with the loading chamber(102). The transfer chamber(105) is connected to each chamber(102,103) by a gate valve(106). The reaction chamber(103) has a susceptor(203) supporting the wafer(101) and plural push-up pins(205) disposed under the susceptor(203). The push-up pins(205) move up and down through holes formed in the susceptor(203). The transfer chamber(105) has a transfer arm(107) horizontally carrying the wafer(101) and a pin-driving arm(108) driving the push-up pins(205) for loading or unloading of the wafer(101). Therefore, the wafer(101) is loaded onto or unloaded from the susceptor(203) by combinational operations of the transfer arm(107) and the pin-driving arm(108).
申请公布号 KR20000048002(A) 申请公布日期 2000.07.25
申请号 KR19990055810 申请日期 1999.12.08
申请人 KOKUSA ELECTRIC CO., LTD. 发明人 MIYAUCHI AKIHIRO;INOUYE YOSUKE;SUJUKI TAKAYA
分类号 H01L21/68;H01L21/205;H01L21/677;(IPC1-7):H01L21/68 主分类号 H01L21/68
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