发明名称 METHOD OF FORMING DIELECTRIC THIN FILM PATTERN AND METHOD OF FORMING LAMINATE PATTERN COMPRISING DIELECTRIC THIN FILM AND CONDUCTIVE THIN FILM
摘要 PURPOSE: A method of forming a laminate pattern and dielectric thin film pattern is provided to form the laminate pattern composed of a low loss dielectric thin film and a conductor thin film and constituting a high frequency device such as a high frequency transmission line, a high frequency resonator, a high frequency capacitance element by using lift-off technology. CONSTITUTION: A method of forming a dielectric thin film pattern comprises the steps of depositing a dielectric thin film on the substrate, forming a resist pattern thereon using a vapor deposition method and removing the resist pattern to form a patterned dielectric thin film, wherein a material used for the dielectric thin film is at least one of CeO2, Sm2O3, Dy2O3, Y2O3, TiO2, Al2O3, and MgO.
申请公布号 KR20000047722(A) 申请公布日期 2000.07.25
申请号 KR19990052686 申请日期 1999.11.25
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KOSHIDO YOSHIHIRO;TAKAHASHI RYOICHIRO;FUJIBAYASHI KEI;OKAWA TADAYUKI;TOYOTA YUJI
分类号 H05K3/46;H01L21/02;H01L21/027;H01L21/302;H01L21/3065;H01L21/316;H01P3/16;H05K1/02;H05K3/04;(IPC1-7):H01L21/027 主分类号 H05K3/46
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