| 摘要 |
PURPOSE: A supplying device of polishing liquid is provided to supply the polishing liquid to a CMP (chemical mechanical polishing) device. CONSTITUTION: A crude liquid of polishing liquid(18a) contained a crude liquid tank of polishing liquid(13a) and a crude liquid of polishing liquid(18b) contained a crude liquid tank of polishing liquid(13b) are supplied in a tank of polishing liquid(1) through pipes(11a,11b). An amount of polishing crude liquids(18a,18b) is existed at a regular ratio by controlling through pumps(12a,12b). The polishing liquids(18a,18b) are mixed with a polishing liquid(2) at an appropriate ratio and are agitated in the tank of polishing liquid(1). The mixture of the polishing liquid(2) and the polishing liquids(18a,18b) are called as 'the polishing liquid(2)'. In a CMP, a needed amount of the polishing liquid(2) is supplied to a CMP device(16) through a pipe(9). The needed amount is controlled by a pipe(10).
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