| 摘要 |
PURPOSE: An epoxy resin composition for encapsulation is provided to have excellent in both storage stability and rapid curability. CONSTITUTION: An epoxy resin composition for encapsulation comprises an epoxy resin, a phenolic resin, and a combination of a cure accelerator and cure accelerator-containing microcapsules having a core/shell structure in which a cure accelerator as a core is encapsulated in a thermoplastic resin shell. |
