| 摘要 |
PURPOSE: A contactor for testing a semiconductor device and a method for manufacturing the contactor, and a carrier for testing the device are provided to enhance reliability, to simplify a manufacturing process, and to economize components. CONSTITUTION: A contactor(10A) is electrically coupled to electrodes(2) of semiconductor devices(1) such as a bare chip, a wafer, or various packages, to perform a desired test of the device(1). The contactor(10A) includes a wiring substrate(11A) and a stiffener(12A) fixedly adhered to a rear surface of the substrate(11A). The wiring substrate(11A) has a base film(13A) such as polyimide and a number of conductive patterns(14) formed on the base film(13A). In addition, each conductive pattern(14) is connected to a contact pad(15) corresponding to the electrode(2) at the inner end, and to a terminal pad(16) at the outer end. Furthermore, the contactor(10A) is used for a test carrier together with a pressing tool. When the semiconductor device(1) is placed on the wiring substrate(11A) of the contactor(10A), the pressing tool presses downward the device(1) so that the electrodes(2) are electrically coupled to the contact pads(15) on the substrate(11A). |
