| 摘要 |
PROBLEM TO BE SOLVED: To obtain an aq.soln. for electroless Cu plating which does not substantially contain Na, is preferable for the environment, is excellent in thermal stability and has a long life by incorporating a copper source of Cu (II) ions, a reducing agent, an additive for pH control and a specified compd. for complexing Cu ions therein. SOLUTION: In an aq.soln. for electroless Cu plating contg. a copper source of Cu (II) ions such as CuSO4.5H2O a pH adjusting additive, a reducing agent and a compd. for complexing Cu ions, as this compd., the one having a chemical structure of COOR1-COHR2 (R1 denotes an organic group covalently bonded to a carboxylate group, and R2 denotes hydrogen or an organic group) such as diethyltartrate is used. Moreover, as the reducing agent, formaldehyde of <1M or the like is preferable. In this aq.soln., pH is controlled to 11.0 to 13.5, and temp. is controlled to <=45 deg.C, when dipping a matrix into this solution, a Cu-contg. layer of 100 to 2000 nm is formed on the active face of a Cu-diffused bulkhead layer of Ti or the like in the matrix, and, if required, a Cu-contg. metal is electroplated on the layer.
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