EPOXY RESIN AND RESIN-SEALED TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE: A novolak epoxy resin having a low viscosity which is useful as an electric and electronic materials such as an adhesive, a paint, an insulating material, a laminate and the like and an epoxy resin composition containing thereof and a resin-sealed type semiconductor device are provided. CONSTITUTION: An epoxy resin is a novolak epoxy resin having a gel permeation chromatography's percentage of area of compound having a binuclear body of more than 15%, and particularly more than 30%. The novolak epoxy resin is an ortho cresol novolak epoxy resin. The epoxy resin composition contains an epoxy resin and an epoxy hardening agent as essential components. The resin-sealed type semiconductor device is prepared by sealing the semiconductor by hardening the epoxy resin composition.