MODULAR SEMICONDUCTOR RELIABILITY TEST SYSTEM

摘要

PURPOSE: A modular semiconductor reliability test system is provided to prevent a life from being short due to a thermal stress by using a material having a low thermal conductivity and to improve confidence in testing a board by making each slot having a same distance from a heat source. CONSTITUTION: A system including an oven having open axial ends for slideably receiving a board. The board includes an oven region which is removably received in the oven and which is located intermediate connection and exterior regions located axially outside of the oven. A temperature sensor is positioned in the oven region and its calibration device is located in the exterior region. Contacts on the axial free edge of the connection region are slideably received in an electrical connector. The board is formed of low heat transfer material so that the connection and exterior regions and the electrical connector is not heated by the oven and includes a handle on the axial free edge of the exterior region. The heat transfer element of the oven has a large thermal mass and is in close and uniform proximity to the DUTs received on the board.