发明名称 POLYAMIDE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a polyamide composition which can give a molding having excellent heat resistance, water absorption characteristics, and chemical resistance by blending two polyamides in a specified ratio. SOLUTION: This composition is obtained by blending polyamide A with polyamide B in a weight ratio satisfying the relationships: B/(A+B)×100>=10. Polyamide A comprises units selected from the group consisting of hexamethylene terephthalamide units (a), hexamethylene isophthalamide units (b), hexamethylene adipamide units (c), and capramide units (d) on conditions that any of the following relationships is satisfied: a/b=55/45 to 80/20, a/c=20/80 to 80/20, and a/d=55/45 to 90/10. Polyamide B comprises dicarboxylic acid units containing 60-100 mol% terephthalic acid units and diamine units containing 60-100 mol% 1,9-nonanediamine units and/or 2-methyl-1,8- octanediamine units in a molar ratio of the former units to the latter units of 100/0 to 20/80.
申请公布号 JP2000204239(A) 申请公布日期 2000.07.25
申请号 JP19990002562 申请日期 1999.01.08
申请人 KURARAY CO LTD 发明人 TAKAMOTO KATSUNORI;OKA HIDEAKI
分类号 C08L77/00;C08L77/06;(IPC1-7):C08L77/00 主分类号 C08L77/00
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