| 摘要 |
PURPOSE: A capacitive mounting structure for improvement of electrical reliability of a semiconductor package is to form a capacitive component at the ground leadframe, thereby stabilizing semiconductor devices of the semiconductor package. CONSTITUTION: A capacitive mounting structure for improvement of electrical reliability of a semiconductor package comprises a semiconductor chip(14), a lead frame(13) on which the semiconductor chip is mounted and a part of the semiconductor chip is attached by a tape(12) interposed therebetween, the tape being functioning as a capacitor having a static capacitance. The tape is made of a dielectric having a distribution capacitive component or a concentration capacitive component. The capacitive mounting structure comprises a die attach pad on which the semiconductor chip is mounted.
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