SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a method for manufacturing the same are provided to reduce the resistance of the multi-layer structure of the semiconductor device. CONSTITUTION: A semiconductor device includes a metal interconnection(111) as well as a via plug. The metal interconnection(111) is implemented on the semiconductor substrate. The via plug is formed so as to be connected with the surface of the metal interconnection. The outer surface of the metal interconnection is coated with a barrier metal film. One of the interconnection layers includes a plurality of metal interconnection including various line width. And the interconnection layer according to the present invention is formed so as to be connected with the surface of the plurality of metal interconnection.