| 摘要 |
PURPOSE: A method for detecting a polishing end point of a wafer and an apparatus for detecting the polishing end point are provided to reduce the variation on the data of the end points. CONSTITUTION: A method for detecting a polishing end point of a wafer according to the present invention includes following steps. At the first step, a light from a light source illuminates, and the reflected light is focused by an optical fiber(313). At the second step, a color sensor(300) senses the color factor of the material on the wafer(w). At the third step, the color sensor determines on status when the color factor is sensed, or the color sensor determines off status when the color factor is not acknowledged. At the forth step, the number(m) of off status is detected during polishing the wafer. At the fifth step, the end point is determined when the number(m) of off status is equal to a predetermined optimal polishing finishing number of time(n). |
