发明名称 |
Electroplating apparatus |
摘要 |
An electroplating apparatus is made up of a cup having a plating solution therein, a plating solution controlling unit which overflows the plating solution from the cup, a holding unit which holds an object to be plated so as to contact to the overflowed plating solution, and a mesh shaped anode electrode provided in an internal portion of the cup, the mesh shaped anode electrode having a surface comprising a metal which are plated by the plating solution. Accordingly, the electroplating apparatus can get the plated film having a smooth surface.
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申请公布号 |
US6093291(A) |
申请公布日期 |
2000.07.25 |
申请号 |
US19980126845 |
申请日期 |
1998.07.31 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
IZUMI, TAKAYUKI;OKAJIMA, TAKEHIKO |
分类号 |
C25D5/08;C25D7/12;C25D17/12;(IPC1-7):C25D17/00;C25B9/00;C25B11/00 |
主分类号 |
C25D5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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