| 摘要 |
PURPOSE: A chip module and a method for producing the chip module are provided to enable more effective utilization of chip surfaces connected to a chip carrier and thereby to realize a chip size package. CONSTITUTION: A chip module(20) includes a chip carrier(21) and at least one chip(22). The chip carrier(21) is designed as a foil having a supporting layer(23) made of synthetic material and a strip conductor structure(24) with strip conductors(28), and connected with the chip(22) by an inserted array of a filling material(37). The strip conductors(28) are connected on their front side with connecting surfaces(32) of the chip(22), and have external contact areas(26) on their rear side(27) to form two-dimensionally distributed members(29) connecting the chip module(20) with an electronic component or a substrate(31). In particular, the strip conductors(28) extend to a plane on a chip contact side of the supporting layer(23) facing the chip(22), the external contact areas(26) are formed by recesses in the supporting layer(23) which extend against the rear side(27) of the strip conductors(28), and the supporting layer(23) extends on the area of the connecting surfaces(32) of the chip(22). |
