发明名称 ADAPTER CONVERTING COMPONENT SPACING
摘要 PURPOSE: An adapter converting component spacing is provided to mount SMD(surface mount device) type and general package type devices with relatively lower cost. CONSTITUTION: An adapter converting component spacing includes a lower substrate(10), an upper substrate(20), and a coupling connector(30). The lower substrate(10) is attached on a substrate for an object to be mounted with a same size and pitch spacing to a SMD component. The upper substrate(20) includes a socket(21) on which a hardware of a general package type. The coupling connector(30) connects signal lines of upper and lower substrates. The lower surface of the lower substrate(10) further has small thickness.
申请公布号 KR20000047155(A) 申请公布日期 2000.07.25
申请号 KR19980063938 申请日期 1998.12.31
申请人 KOREA AEROPACE RESEARCH INSTITUYE 发明人 CHEON, LEE JIN;JEONG, CHANG HO
分类号 H01R13/40;(IPC1-7):H01R13/40 主分类号 H01R13/40
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