发明名称 |
ADAPTER CONVERTING COMPONENT SPACING |
摘要 |
PURPOSE: An adapter converting component spacing is provided to mount SMD(surface mount device) type and general package type devices with relatively lower cost. CONSTITUTION: An adapter converting component spacing includes a lower substrate(10), an upper substrate(20), and a coupling connector(30). The lower substrate(10) is attached on a substrate for an object to be mounted with a same size and pitch spacing to a SMD component. The upper substrate(20) includes a socket(21) on which a hardware of a general package type. The coupling connector(30) connects signal lines of upper and lower substrates. The lower surface of the lower substrate(10) further has small thickness.
|
申请公布号 |
KR20000047155(A) |
申请公布日期 |
2000.07.25 |
申请号 |
KR19980063938 |
申请日期 |
1998.12.31 |
申请人 |
KOREA AEROPACE RESEARCH INSTITUYE |
发明人 |
CHEON, LEE JIN;JEONG, CHANG HO |
分类号 |
H01R13/40;(IPC1-7):H01R13/40 |
主分类号 |
H01R13/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|