| 摘要 |
PURPOSE: A method for polishing notch of notch polishing apparatus in single surface polishing apparatus is provided to obtain uniformity of polishing by polishing a notch with rotating a pad for polishing the notch in a forward and a backward direction when polishes a notch of a wafer. CONSTITUTION: In a method for polishing notch of notch polishing apparatus in single surface polishing apparatus, the single polishing apparatus includes a supply member for supplying a wafer received in a cassette, a notch polishing member for polishing a notch of a supplied wafer, a polishing member for polishing a peripheral surface of the wafer; and a discharging member having a cassette for receiving the wafer polished in the polishing member. A notch polishing apparatus(22) is arranged and mounted in the notch polishing member, which comprises a absorption member(30) for laying the supplied wafer thereon in a horizontal state; a pad(22) for polishing the notch, which polishes the notch of the wafer; and a polishing member(34) being capable of approaching to and separating from the absorption member(30). The notch polishing apparatus(22) adopts a device for polishing the notch with rotating a pad(22) for polishing the notch in a forward and a backward direction.
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