METHOD AND CONNECTION ARRANGEMENT FOR PRODUCING A SMART CARD

摘要

PURPOSE: A method and connection arrangement for producing a smart card are provided to establish an electrical and mechanical connection by a semiconductor chip located on a module being inserted in a recess in a card holder. CONSTITUTION: A connection arrangement includes a smart card (1), a semiconductor chip located on a module (3) being inserted in a recess (2) in a card holder (1). Instead of the substance-bonded and/or force-locking connections necessary hitherto, an inductive and/or capacitive coupling between the module and IC card is used. To that end, the module and card comprise appropriate coils (4) and/or capacitive coupling surfaces for transmitting signals.