| 摘要 |
PCT No. PCT/JP96/01136 Sec. 371 Date Oct. 28, 1997 Sec. 102(e) Date Oct. 28, 1997 PCT Filed Apr. 25, 1996 PCT Pub. No. WO96/35232 PCT Pub. Date Nov. 7, 1996An exclusive carrier (EQMC) housing therein equipment testing wafers (EQMW) is housed in a carrier housing rack (32) of a treatment equipment. An equipment testing parameter setting section (62) is provided for setting a cycle, in which the equipment testing wafers (EQMW) are carried in a heat treating furnace (21), and the number and holding position of the equipment testing wafers on a wafer boat (23). The equipment testing wafers (EQMW) are held in dummy wafer holding regions (D) at the upper and lower end portions of the wafer boat (23) to be heat-treated in the set cycle. After the heat treatments of all the equipment testing wafers (EQMW) in the equipment testing carrier (EQMC) are completed, the wafers (EQMW) are transferred to a detecting device, and the state of the treatment equipment is grasped on the basis of the treated state. Thus, when semiconductor wafers are treated by means of a batch heat treatment equipment, the state of the treatment equipment can be tested by means of the equipment testing wafer, and the treatment equipment can be easily used.
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