SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP MOUNTING SUBSTRATE, METHODS OF MANUFACTURING THE DEVICE AND SUBSTRATE, ADHESIVE, AND ADHESIVE DOUBLE

摘要

PURPOSE: An adhesive, a double-sided adhesive film, a semiconductor device, a semiconductor chip mounting substrate, and a method of manufacturing the device are provided to improve temperature-cycle resistance after packaging and to improve moisture-absorbed reflow resistance, a process for fabricating such a semiconductor device. CONSTITUTION: An adhesive has a storage elastic modulus at 25°C of from 10 to 2,000 MPa and a storage elastic modulus at 260°C of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process