| 摘要 |
PURPOSE: An arrangement structure of a fine pitch and a multi-pin wire connecting pad and a wire connecting method are provided to prevent a separation of pad, a mis-arrangement of wire and a connection defect of the wire. CONSTITUTION: An arrangement structure of a fine pitch and a multi-pin wire connecting pad have a two-row arrangement of a chip device pad(12) and a connecting pad(11) which are respectively arranged in the form of zigzag type so that the chip device pad and the connecting pad are arranged in parallel with each other. In the arrangement structure, edges of the connecting pad is treated by a passivation process so that the connecting pad is strongly attached to a stacked substrate(14). An area occupied by an arrangement of the chip device pad is equal to that occupied by an arrangement of the connecting pad, thereby minimizing a size of a chip module. |
