| 摘要 |
PURPOSE: A method and device for testing a semiconductor is provided to test the semiconductor in high frequency operation specifications with lower price. CONSTITUTION: A method for testing a semiconductor device includes following steps. At the first step(s10), attachment state is formed attaching one of the semiconductor device assembly or individual semiconductor device on an attachment tape implemented on a tape holding member. At the second step(s11) the holding member is mounted on a position compensator which is configured to perform position recognition as well as position compensation by using image processing technology on the semiconductor device attached on the attachment tape. At the third step, on the individual semiconductor device position recognition(s17) and position compensation(s19) are performed. At the forth step, the semiconductor is pressed against a test contactor(s20). At the fifth step(s25), electrical characteristic test(s25) is performed on the semiconductor device.
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