发明名称 |
SOLID IMAGE PICK-UP DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
PURPOSE: An image pick-up device is to reduce a turn around time by forming each transfer gate by patterning one polysilicon layer and improve a reliability of the device by preventing a generation of etching remainder. CONSTITUTION: A solid image pick-up device comprises: a second conductive well(32) formed in a first conductive semiconductor substrate(31) to a predetermined depth; a first conductive BCCD(bulk charge coupled device) area(33) formed in the second conductive well to a predetermined depth; a gate insulating film(34) formed on the BCCD area; a first transfer gate(35a), a second transfer gate(35b) and a third transfer gate(35c) arranged in a predetermined distance on the gate insulating film; a second conductive impurity area formed on a surface of the BCCD area under an isolated area of the first, second and third transfer gates; a first interlayer insulating film(37) formed on the third transfer gate and having a first contact hole; and a first metal line(38) formed in one directional line type on the first contact hole and the first interlayer insulating film.
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申请公布号 |
KR20000046214(A) |
申请公布日期 |
2000.07.25 |
申请号 |
KR19980062891 |
申请日期 |
1998.12.31 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO., LTD. |
发明人 |
CHOI, BYUNG HWAN;CHOI, IN GYU |
分类号 |
H01L27/148;(IPC1-7):H01L27/148 |
主分类号 |
H01L27/148 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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