| 摘要 |
PURPOSE: An integrated circuit bonding system and method thereof are provided which reduces the cost of an IC chip by reducing the silicon area consumed for the whole circuit design. CONSTITUTION: In a structure of an integrated circuit having a bonding pad, at least a part of the integrated circuit is arranged on the bottom of a contact pad, and is connected to the pad electrically through a via(205). And, an assembly of a metal layer(207) able to be bonded, a metal layer(206) for absorbing stress and an electrical insulation layer(204) mechanically reinforced separate the contact pad from a part of the integrated circuit, and have a sufficient thickness to protect the integrated circuit from the effect of the bonding. |
