发明名称 POLYPROPYLENE RESIN COMPOSITION WITH IMPROVED MELT FLOW, HEAT RESISTANCE, AND LOW TEMPERATURE IMPACT STRENGTH
摘要 PURPOSE: A polypropylene resin composition is provided which has improved melt flow, heat resistance, and low temperature impact strength, such composition being consisted of homopolypropylene, ethylene propylene copolymer, and inorganic nucleating agent. CONSTITUTION: A polypropylene resin composition is consisted of 0.1-5parts by weight of inorganic nucleating agent based on 100 parts by weight of resin being composed of 60-95 wt.% of homopolypropylene and 5-40 wt.% of copolymer of ethylene and propylene, wherein the homopolypropylene comprises not less than 95% of isotactic pentad fraction, and the molecular weight distribution of the homopolypropylene is 7-12, and melt index of the homopolypropylene is 0.5-40g/10minute, and the inorganic nucleating agent is talc nucleating agent of which the particle diameter is not more than 6.0 micrometer and the average particle diameter is 2.0 micrometer.
申请公布号 KR20000047006(A) 申请公布日期 2000.07.25
申请号 KR19980063753 申请日期 1998.12.31
申请人 SAMSUNG GENERAL CHEMICALS CO., LTD. 发明人 CHOI, YEON BUM;LEE, YEONG JUN;RHO, KI SU
分类号 C08L23/10;C08K3/34;C08L23/12 主分类号 C08L23/10
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