| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition having high flame retardancy in spite of containing no halogen compound or phosphorus flame retardant and not adversely affecting the properties of a product by mixing a specified epoxy resin with a curing agent and a compound containing a metal atom. SOLUTION: The epoxy resin used has at least two epoxy groups in the molecule and is other than a halogenated epoxy resin. The curing agent used is a compound or resin having at least two phenolic hydroxyl groups in the molecule. The curing agent for a semiconductor sealing material is desirably a novolac phenolic resin, a resol phenolic resin, or the like. The compound having a metal atom is desirably a compound having at least one metal atom selected from among Al, Si, Mn, Fe, Co, Ni, Cu, An, and Sn. This compound is desirably a metal complex or a metal oxide for the sake of its stability, though it may take any form.
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